The ASSCON’s vacuum soldering process machine combines the average of the vapor-phase with the vacuum process. This process greatly improves the solder joints relative to void formation. Particularly when using lead-free solder. Through the use of the vacuum process, the developing inclusions are extracted before the solidification phase.

Advantages:

• Soldering of cased power components on printed circuit boards
• Area reflowing of components on heat-sink plates
• Soldering of power chips on a base substrate with paste or solder foils
• Hermetic soldering of high-frequency penetrations
• Making solder connections of large-area electrical and mechanical components
• Elimination of voids with through-holes or other leaded connections for components to improve heat sinking
• Reflowing of large area SMTs or connectors on multilayers
• Repair of SMTs or conventional connectors in high-multilayers
• Simultaneous soldering of active and power components
• Soldering of 3D assemblies

Vacuum soldering process

In the process zone of the vapor-phase soldering machine, the assembly is pre-heated and soldered under inert conditions. The vacuum module is integrated into the process zone. Immediately after completing the soldering process the vacuum module seals the assembly from its environment and starts the evacuation. The negative pressure removes voids and entrapments from the solder which is still in a liquid state. The vacuum module is ventilated and opened again. Subsequently, the product moves through the cooling zone to be unloaded and ready for the next process.