We have complete in-house assembly capabilities to provide a full turnkey solution to our customer’s needs. We assemble all variations from basic thru hole to very fine pitch Micro-Ball Grid Arrays (BGA), servicing industries from Aerospace and Government to Commercial including telecom, computer, peripheral, and multimedia industries.

Whether you have one circuit board or a thousand, Hughes can expedite your project. Rely on Hughes for maintaining complete control of both fabrication and assembly.

We understand that a seamless time-to-market is critical and time-sensitive for your applications. And as a result, our customer base is expanding because of their frustrations with other manufacturers. Hughes Circuits is committed to providing our customers with high-quality printed circuits and assemblies with superior engineering support. We know our success depends upon yours!


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  • Quick-turn PCB assembly
  • Same day quotes
  • Single and double-sided SMT
  • High density
  • Large parts on both sides, including BGA on both sides
  • Mixed technology
  • Automated placement of SMT parts
  • Short strip capability, we do not require parts on reels
  • Stencil design or review and procurement
  • Consigned material
  • Capable of assembling to IPC-A-610 Class III (3) acceptability criteria
  • Capable of assembling to J-STD-001 Space workmanship criteria

SMT Automated Machine Placement

  • All common components
  • Chips down to 0201 (high speed) and 01005
  • BGA and Micro BGA down to 0.012 in. (0.3mm) pitch, ball count greater than 1000
  • Leaded parts to 0.012 in. (0.3 mm) pitch
  • Soldered heat slug containing parts (MO-220, QFN….)
  • Ceramic LCC
  • Parts as large as 3 in. x 3 in. x 0.6 in.
  • Surface mount connectors
  • Odd form parts
  • LED
  • Resistor and capacitor networks
  • Electrolytic capacitors
  • Variable resistors and capacitors (pots)
  • Sockets


  • Maximum size 14.5 in. x 19.5 in. for single images or panelized images
  • Thickness from 0.03 in. to 0.13 in.
  • 2 to 20 layers
  • Fiducials are preferred but not required
  • Finishes
    • Electroless Gold
    • Electroless Silver
    • Immersion Gold
    • Immersion Tin
    • ENIG

Thru Hole

  • All sizes and lead configurations on both sides of the PCB assembly
  • Wave soldering is available


Solder Chemistry

  • Semi-automatic paste application
  • No-clean and Automated water wash flux cleaning is available


  • BGA removal and replacement station by Zephyrtronics
  • SMT microscope rework station
  • Thru-hole rework station


  • X-ray analysis
  • Visual to 20x


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