The 57th International Symposium on Microelectronics

Sept 30 - Oct 2, 2024

Were going to Boston and will be attending the Symposium & working the exhibition hall. 
Please stop by, as we would love to discuss how we can help with your product/device.

Booth #323

The 57th International Symposium on Microelectronics is organized by the International Microelectronics Assembly and Packaging Society and held in Boston, Massachusetts. IMAPS Symposium offers one of the most robust programs for microelectronics and advanced packaging technical content. Each year, we welcome many repeat attendees as well as hundreds of first-time visitors – early career packaging professionals, those new to the industry, and students.

Our event kicks off with Professional Development Courses, followed by 3 days of technical sessions with an emphasis on Design, Modeling, and Manufacturing; Fanout, RDL, WLP / PLP; High Performance / High Reliability; Advanced Package (Flip Chip, 2.5D, 3D, Optical); Advanced Process & Materials (Enabling Technology).